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Reconfigurable RF and Microwave Technologies: Materials, Techniques, and Integration by Jinqun Ge
£69.99
Available
Product Ref. (e.g. ISBN, SKU)
9788770047883
Published:
04 Apr 2025
Format:
Paperback
Number of pages:
47 pages
Dimensions:
234mm
Weight:
0.000kgs
Author:
This is a comprehensive guide to the latest innovations in reconfigurable RF and microwave technologies, providing a deep dive into advanced materials, fabrication techniques, and integration methods that are transforming the industry. It provides both fundamental principles and the latest advancements in RF/microwave design.
This is a comprehensive guide to the latest innovations in reconfigurable RF and microwave technologies, providing a deep dive into advanced materials, fabrication techniques, and integration methods that are transforming the industry. In an era where wireless communication and RF/microwave technologies are continuously evolving, flexible, high-performance, and miniaturized RF and microwave components are in high demand. This book covers essential manufacturing methods such as micromachining, 3D printing, thin film growth methods, and photolithography. It also explores cutting-edge reconfigurable technologies enabled by mechanical tuning, RF MEMS, and semiconductor switches.Each chapter is designed to equip researchers, engineers, and students with practical insights into both the fundamental principles and the latest advancements in RF and microwave design. Whether you're developing tunable RF filters, antennas, or phase shifters, Reconfigurable RF and Microwave Technologies: Materials, Techniques, and Integration serves as an invaluable resource to learn fabrication and integration techniques needed to meet the demands of current and next-generation wireless systems.
About the Author: Jinqun Ge, received his Ph.D. degree from the University of South Carolina, Columbia, SC, USA. His research interests include microwave circuits and components, surface micromachining technologies, ferromagnetic and ferroelectric materials, and smart electrically tunable microwave components. Dr. Ge was a recipient of the 2021 MTT-S Graduate Student Fellowship Award, Best Student Paper Award at the 2020 IEEE MTT-S International Wireless Symposium, and Student Paper Honorable Mention at the IEEE 2020 Antenna and Propagation Symposium. He joined Qorvo US, Inc. in 2023 where he is working on BAW filter design. Dr. Ge is a reviewer for IEEE Microwave and Wireless Components Letters, International Journal of RF and Microwave Computer-Aided Engineering, Journal of Electronic Testing, International Journal of Antennas and Propagation, Physica Scripta, etc.Guoan Wang received his Ph.D. in Electrical and Computer Engineering from Georgia Institute of Technology in 2006. He is currently a Professor in the Department of Electrical Engineering at the University of South Carolina. He worked as an Advisory Scientist responsible for the development of on chip mmwave passives and wafer level RF MEMS technologies at the IBM Semiconductor Research and Development Center from 2006-2011. His research areas include reconfigurable RF and microwave electronics, novel materials/techniques for smart RF applications, MEMS/NEMS, sensors and sensing systems, wireless energy harvesting, and 3D integrated devices/system. Dr. Wang's research work has produced over 140 papers in peer-reviewed journals and conferences proceedings. He also has 62 granted US and international patents, and 52 pending patent applications. Dr. Wang served as an Associate Editor of IEEE Microwave and Wireless Components Letters from 2013-2019, and currently is an Associate Editor of International Journal of RF and Microwave Computer‐Aided Engineering. He is a member of the Technical Coordinating Committee for IEEE MTT TC-6 RF MEMS and Microwave Acoustics, chair of IEEE MTT TC-13 Microwave Control Materials and Devices, and vice-chair of IEEE MTT TC-17 Microwave Materials and Processing Technologies Committee. Dr. Wang is a recipient of the NSF Early Faculty Development (CAREER) Award in 2012, and IEEE Region 3 Outstanding Engineer Award in 2018
| Number of pages | 47 |
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